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[GBA Thrills] Hong Kong Science Park AI Firms Sign Cooperation Pacts in Dongguan
[GBA Thrills] Hong Kong Science Park AI Firms Sign Cooperation Pacts in Dongguan
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A delegation from the Dongguan session of the 2026 CDIC summit (organised by the Hong Kong Science Park) recently visited the Dongguan Binhaiwan New Area in Guangdong Province, South China. The participants, including Hong Kong tech innovators, investment networks, ecosystem partners and local enterprise representatives, toured the National Pilot Test Base for Artificial Intelligence Applications. During the visit, 15 Hong Kong Science Park startups signed memoranda of understanding (MoUs) on AI application cooperation with the base.

 

The base previously participated in Hong Kong events as a key partner, presenting Dongguan’s industrial strengths and offering access to real-world application scenarios to conduct preliminary matchmaking with Hong Kong innovators. During this latest visit, the delegation learned about the base’s capabilities in computing power, foundation model infrastructure, chip adaptation and scenario deployment, as well as its role as Dongguan’s core AI industry platform.

 

Targeted industry workshops led by the base are advancing these preliminary agreements toward concrete cooperation. Going forward, the two sides will deepen cooperation in smart devices, AI and tech services, establishing regular liaison mechanisms to help more Hong Kong innovation projects take root in Binhaiwan and drive high-quality development.

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